1. The rotary worktable can be 2 or 4 stations, suitable for various products, High efficiency for loading & unloading and laser marking at the same time;
2. Full enclosed working area, safe and reliable;
3. Machine equips with motorized lifting system to achieve autofocus, easy for operation, and can cooperate with robot for loading and unloading to achieve automation production;
4. Adopts 355nm green laser source, fine laser spot, applied to various materials, and make prefect marking quality;
5. Imported core parts, good performance, long term stable running;
6. Small space occupation, easy for operation;
7. Self-developed control software, friendly HMI, easy for operation;
8. Compatible with: DXF, PLT and JPG file, dot matrix and self-developed font, various galvo optical path calibration types.
Technical Parameter
| Model | MUV-B-B |
| Power (W) | 3/5/10/15 |
| Marking area(mm) | 110*110/150*150/200*200 |
| Wavelength (nm) | 355 |
| Marking speed (mm/s) | 0-8000 |
| Power supply | AC220V±10%, 50Hz/60Hz |
| Overall dimension (mm) | 1600*820*1800 |
| Weight (KG) | About 500Kg |
| Gross power(KW) | 1.6 |
| Working environment | Temp : 15~30°C, humidity: 5~85%, no dust, no Condensation |
Parts Introduction
Application
Material
Suitable for fine marking of monocrystalline silicon wafer, IC grain, sapphire, plastics, leather, metal, glass, LCD screen, thin ceramic and the special material. It is popular for precise marking of electronics industry.
Sample:
